Copper PELCO® FIB Lift-Out Grid TEM Grids

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Description

Copper PELCO® FIB Lift-Out Grid TEM GridsDESCRIPTION Copper PELCO FIB Lift Out Grid TEM Grids The typical thickness of the copper lift out grids is 35m + 5m. The Cu FIB lift out grids also have a thinner ridge on the inside, where the lamellas can be attached and are protected when stored. Available with either one or two wider v shaped posts or four narrow flat posts with identification number etch through. Use single or dual wider posts for attaching single lamellas or the four posts for

grounding and conductive paths

The unmounted probe chip carrier with lead and BNC connect provides mounting of unmounted probes on a metallic adaptor that interfaces to the CP-II probe cartridge

145nm Very High Resolution AFM Reference Standard on 12mm steel disk

Available with four narrow posts

Specifications: SiC / 0

Each MRS-3 has a unique serial number engraved on the standard

(Also see model MLCT-BIO-DC for a low thermal sensitivity version of the probe

blue epoxy-coated 3C 110mm SS 0

Line height (about 100nm) and line width (about 75nm) are not calibrated

100nm Wide Spike @ 1µm DESCRIPTION

For use with Innova-IRIS only with special cartridge

Numbered 1-100

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