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Description

PELCO® 300 Mesh Special Metal GridsDESCRIPTION SIZE SPECIFICATIONS METAL PURITY SPECIFICATIONS for transmission electron microscopy packed in anti static vials useful for EDX analysis, high temperature and cryo applications packed in anti static vials These grids are available in molybdenum, titanium, aluminum and stainless steel 316. The grids are made by a high precision etching process. The thickness is approximately 25m for Mo and Al, 15m for Ti and 12m for stainless steel. The

4mm) Pin Stub with a 1/8" (3

The calibration area is situated in the center of the chip

The design has been optimized for access and flexibility

as encountered on semiconductor samples and optics

includes a hex key

Cube Corner

even at 500eV

Another feature of the reference TEM grids is that when moving around on the grid

Each chip contains three cantilevers of different force constants

and holder model VITA-CH-MM-HE when used with MultiMode AFMs

Max Overhang = 25 nm

and individually numbered